Products
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Tools and Equipment SMI's tools and equipment are both well-known international brands, each with the best hand tool design; each set of equipment has its unique and sophisticated features, SMI hope to provide the perfect tool to the customer in packaging, optoelectronics, and micro-electromechanical product areas! |
Palomar 3500-ⅢDie Bonder
The placement accuracy for Palomar 3500-III is 12.7μm(3 Sigma). it has huge working stage. It is a independent computer system, it can smoothly pick , move and place a 0.7 mil 2 component in precise place. It can do flip chip , dispensing, and eutectic process. It has 8 position turret heads, which can rapidly change tools on the fly without a space consuming tool dock. It can be arranged with different module and become a multi-function assembly line.
Product Application:
- Chip on board (COB)
- Fine pitch SMT
- Flip chip
- High bright (HB) LED assembly
- High power (HP) LED assembly
- Hybrid microcircuits
- Laser diodes
- Micro-Electrical-Mechanical systems (MEMs)
- Micro-Optical-Electrical-Mechanical systems (MOEMs)
- Microwave modules
- Multi-chip modules (MCMs)
- Optoelectronic modules
- RF packages
- Stacked die
- AuSi eutectic scrub
- AuSn eutectic solder attach
- PbSn solder preform
- Anisotropic Conductive Paste (ACP) for flip chip
- attachment
- High accuracy placement of optical components
- UV Curing
- has 8 position turret heads, which can rapidly change tools on the fly.
- 710 square inch (35.5''x20'') working zone, reduce the change component, it can accommodate different kind of substrates.
- Automatically assembly by using eutectic method, high production yield, high accuracy component replacement.
- BDM and RAM system can check whether the machine is in good condition or not. It can also predict the next process flow.
- Auto loading for substrate and component, it improves the production yield.
- Linear encode system: enhance accuracy
- Eutectic control: control temperature and time by different application.
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