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Tools and Equipment SMI's tools and equipment are both well-known international brands, each with the best hand tool design; each set of equipment has its unique and sophisticated features, SMI hope to provide the perfect tool to the customer in packaging, optoelectronics, and micro-electromechanical product areas! |
Palomar 8000 Wire Bonder is a automatic wire bonder. It is a reliable machine in assembly field. It has wide range of working stage. The deep access(2 cm) ability can enchance production yeild and reduce other variable cost.
Palomar 8000 Ball(Stud) Bumper uses the advance technology. It can bump a flat gold ball on wafer directly. There is no need for a secondary coining process. While doing flip chip process, it can reach the requirement of small and thin package.
The automatically planarBump provide the best environment to use gold ball to replace silver ball. It can bump high density ball, the stable and excellent machine can satisfy the nanometer technology.
Palomar Model 8000 Automated Wire Bonder & Automated Ball Bumper:
Application:
- Automotive assemblies
- Chip on board (COB)
- Disk drive assemblies
- Fine pitch devices
- Flex circuits
- High bright/high power LEDs
- Large complex hybrids
- Multichip modules (MCMs)
- Multi-tiered ICs
- Specialty lead frames
- Stacked die
- System in packages (SIPs)
- Automated assembly of quality components results in extremely high yeilds and repeatable, predictable electrical performance.
- If can be worked as an individual or match the SMD production line.
- Deep access capability enables wire placement into deep
- Huge working zone(12''*6''), it can put most of the material during assembly process, reduce iindex time to enhance yeild.
- Bond Data Miner™ (BDM) system can check whether the machine is in good condition or not. It can also predict the next process flow.