Hysol® Electronic Molding Compounds protect passive components, such as ceramic and tantalum capacitors and resistors, and are designed for both automolds and conventional molds. Our unique gold compounds are ideal for high contrast laser marking and are available in fast cure versions for high productivity. You can also choose from cutting-edge low stress compounds, capable of thin wall designs for today’s relentless demands to miniaturize every component. New generation molding powders have been designed to meet electronics industry’s need for plastics that are environmentally friendly and resistant to cracking after 260°C IR reflow. New blends of proprietary flame retardants are used to replace the traditional antimony oxide/halogenated resin flame-out systems. The materials are a new family that pass UL standards and meet the EU’s environmental requirements (i.e., no halogens, no heavy metals). Combining these new flame retardants with new resin technology and filler blends has produced a series of ultra low stress materials that resist cracking after exposure to 260°C IR reflow conditions.