Products
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Semiconductor Packaging Materials SMI agent variety of well-known international brands of semiconductor packaging materials, can be widely used in various forms of IC packaging: such as TSOP, TO, QFP, QFN, BGA, CSP-cum-variety of CSP, Flip Chip packaging and so on. Can also be used in the tantalum capacitor, memory cards and other related products. |
Soldering Paste/Soldering ball/Flux
DanYang Soltec Korea is an ISO manufacturers which product solder paste, solder balls, solder bar, flux and so on. Tin powder particle size is between 5 ~ 45 um; products advertised not to harm the environment and human. It has the world's sole patent certification, using a variety of sophisticated testing equipment to control product quality, and has gain favor from the manufacturers of US, Japan, and South Korea.
Solder Paste
| Model | Flux Type | Alloy | Powder Size | Melting Point | Features |
 | No Clean | 63Sn/37Pb 62Sn/36Pb/2Ag NT4S |
20~45um 20~30um 5~10um | 183°C 179°C1 78~184°C |
◎ Excellent Wetting Characteristic ◎ No Cleaning Solderpaste ◎ Good Printerability for Fine Pitch ◎ Fast Printing Speed and little adhere ◎ Halide free |
 | Water | 63Sn/37Pb 62Sn/36Pb/2Ag NT4S |
20~45um 20~30um 5~10um | 183°C 179°C1 78~184°C |
◎ Excellent Wetting Characteristic ◎ No Cleaning Solderpaste ◎ Good Printerability for Fine Pitch ◎ Fast Printing Speed and little adhere ◎ Halide free |
 | No Clean | 96.5Sn/ 3.0Ag/ 0.5Cu Sn/1.7Bi/ 0.8Cu/ 0.6In (Patent) 42Sn/ 58Bi |
0~45Bm 20~30Bm | 217~220°C 205~221°C 139°C |
◎ Excellent Wetting Characteristic ◎ No Cleaning Solderpaste ◎ Good Printerability for Fine Pitch ◎ Fast Printing Speed and little adhere ◎ Halide free ◎ Minimize Flux Carbonization |
 | Water | 96.5Sn/ 3.0Ag/ 0.5Cu Sn/ 1.7Bi/ 0.8Cu/ 0.6In (Patent) 42Sn/ 58Bi |
20~45Bm 20~30Bm | 217~220°C 205~221°C 139°C |
◎ Excellent Wetting Characteristic ◎ No Cleaning Solderpaste ◎ Good Printerability for Fine Pitch ◎ Fast Printing Speed and little adhere ◎ Halide free ◎ Minimize Flux Carbonization ◎ Minimize Flux Carbonization |
Solder Ball
| Model | Flux Type | Alloy | Powder Size | Melting Point | Features |
 | Ball | Sn/Pb Sn/Ag/Cu Sn/Ag/Cu/X Sn/Bi/Cu/In |
762, 630 530, 450 350, 300 250 Bm | 183°C 217~220°C 205~221°C |
◎Excellent Wetting Characteristic ◎Sphere ◎Shiny ◎Many kind of Alloy |
Flux
| Model | Flux Type | Appearance | Solid Contents | S/G (25°C) | Features |
 | No Clean | Pale Yellow | 5.5% | 0.800 Typical | ◎Excellent Surface Wetting ◎Rosin Type ◎Very Little Residue ◎Halide free |
 | No Clean | Clear Colorless | 5% | 1.020 Typical | ◎Excellent Surface Wetting ◎VOC & Halide free ◎Very little Residue ◎Water Soluble ◎Leadfree Application |
 | Water | Gel type amber | - | - | ◎BGA Package Application ◎Excellent Surface Wetting ◎VOC & Halide free ◎Neutrality |
 | No Clean | Gel type amber | - | - | ◎BGA Package Application ◎Excellent Surface Wetting ◎VOC & Halide free ◎Neutrality ◎Water Cleanable |
