Products
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Semiconductor Packaging Materials SMI agent variety of well-known international brands of semiconductor packaging materials, can be widely used in various forms of IC packaging: such as TSOP, TO, QFP, QFN, BGA, CSP-cum-variety of CSP, Flip Chip packaging and so on. Can also be used in the tantalum capacitor, memory cards and other related products. |
Semiconductor Packaging Materials/Molding
Henkel's Hysol ® and Hysol ® Huawei ™ Molding Compound provide excellent performance and ease of use. Combination of low stress, low moisture absorption, high-performance, all of Henkel Mold Compound is to ensure the optimized process at high yields even in the most demanding lead-free environmants.
In line with EU regulations and the green environmental protection material, a unique formula does not contain halogen and lead-free to meet RoHS requirements.
Henkel developed innovative Mold compound materials for use with today's multi-memory card (MMC) and Package on Package (POP) applications.
Hysol ® one of the Henkel range of chemical materials brand
| Product Type | Product No. |
| Hysol® Huawei™KL1000-3LX™ Hysol® Huawei™KL1000-4T™ Hysol® Huawei™KLG100™ Hysol® Huawei™KLG200™ Hysol® GR360A-F8™ Hysol® Huawei™KL5000HT™ Hysol® GR750™ Hysol® GR750-SC™ Hysol®GR750HT-25™ Hysol®MG15F™ Hysol® GR15F-1™ |
| Hysol® Huawei™KL7000HA™ Hysol® GR828D™ Hysol® Huawei™ KLG730™ Hysol® GR868™ Hysol® Huawei™KL4500-1NT™ Hysol® GR828D™ Hysol® Huawei™ KLG900HP™ Hysol® Huawei™KLG900HC™ Hysol® Huawei™KL8500™ Hysol® Huawei™KLG750™ Hysol® GR640HV™ Hysol® Huawei™KL6500S™ Hysol® Huawei™KLG200S™ |
| Hysol®GR9810™ series Hysol® GR9810-1P™ Hysol® GR9851M™ |
Representation of the above products only provide a reference, for more information please contact us +886-2-2758-0920
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