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Semiconductor Packaging Materials SMI agent variety of well-known international brands of semiconductor packaging materials, can be widely used in various forms of IC packaging: such as TSOP, TO, QFP, QFN, BGA, CSP-cum-variety of CSP, Flip Chip packaging and so on. Can also be used in the tantalum capacitor, memory cards and other related products. |
Semiconductor package after a certain number of mold can cause a certain degree of contamination on the mold surface, if the continued use of plastic semiconductor materials will lead to decreased surface finish, reducing mold life, which would seriously harm the quality of the product's appearance. Clean compound can be an effective way to remove residual dirt in the mold and keep mold in good condition, but also to ensure the stability of production quality! Semiland clean compound has been certified by domestic manufacturers, and can also be used with SMI clean technology, which reduces the number of the clean time (Cure time only 150 seconds), can save almost 1 / 3 of the clean cost and increase production capacity, and shorter delivery time and price competitive advantage. It is the best combination of clean method.
SMI Clean Compound can be identify as Transfer Type and Compression Type
| Transfer Type  |
Compression Type  |
| Φ 11mm / Φ 13mm / Φ 14mm / Φ 15mm / Φ 16mm / Φ 18mm / Φ 20mm / Φ 40mm / Φ 48mm / Φ 50mm / Φ 55mm. |
Φ 2.0 inch / Φ 23mm/ Φ 40mm / Φ 50mm / 38mm x 68mm |
| White | White |
| 1.4 ~ 1.7g/㎤ | 1.3 ~ 1.5g/㎤ |
| 25 ~ 40 inch | N/A |
| 30 ~ 45 sec | N/A |
| > 70 | > 70 |
| 0.7 ~ 1.2% | 0.9 ~ 1.2% |
| 12 months after manufacturing | 12 months after manufacturing |
| maintain or lower than 25℃ | maintain or lower than 25℃ |
| 1.1 ~ 1.5 g/㎤ | 1.1 ~ 1.5 g/㎤ |
| Order specifications ± 0.3g | Order specifications ± 0.3g |
| Order specifications -0.6mm/+0mm | Order specifications ±2.0mm |
Representation of the above products only provide a reference, for more information please contact us +886-2-2758-0920