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Semiconductor Packaging Materials SMI agent variety of well-known international brands of semiconductor packaging materials, can be widely used in various forms of IC packaging: such as TSOP, TO, QFP, QFN, BGA, CSP-cum-variety of CSP, Flip Chip packaging and so on. Can also be used in the tantalum capacitor, memory cards and other related products. |
NSK, professional manufacturer of stamping leadframe for over 60 years, it is the world's first stamping lead frame company, using high-speed stamping machines, stamping precision pitch up to 0.12mm, a substantial amount of savings in gold thread. Applicable to precision IC and IC / LED / TO high-power products. It is pointed by a number of Japanese companies as the specified brand in Taiwan OEM. It has 10 kinds of Open Tool, and accept the exclusive Custom Close Tool.
![]() QFP |
![]() LQFP |
![]() TSOP |
Type of lead frame:
| Item | Thickness | ILP | Die Pad | Material | Downset | Pkg | Array | Plating |
| TSOP 48L | 0.125 | 0.215 | 200×170 | C7025 | 0.155 | 12×18 | 2×8 | R-Ag |
| TSOP 48L | 0.125 | 0.28 | 290×260 | C7025 | 0.155 | 12×18 | 2×8 | R-Ag |
| 100L LQFP | 0.125 | 0.13 | 145×145 | C7025 | 0.17 | 14×14 | 3×10 | Double R-Ag |
| 128L QFP | 0.15 | 0.18 | 236×236 | C7025 | 0.2/0.33 | 14×20 | 1×6 | Spot-Ag / R-Ag |
| 128L LQFP | 0.125 | 0.18 | 236×236 | C7025 | 0.17 | 14×20 | 1×6 | Spot-Ag / R-Ag |
| 128L QFP | 0.15 | 0.18 | 180×180 | C7025 | 0.2 | 14×20 | 1×6 | Spot-Ag / R-Ag |
| 128L LQFP | 0.125 | 0.18 | 180×180 | C7025 | 0.17 | 14×20 | 1×6 | Spot-Ag / R-Ag |
| 128L QFP 2MTX | 0.15 | 0.15 | 180×180 | C7025 | 0.2/0.33 | 14×20 | 2×8 | Spot-Ag / DoubleR-Ag |
| 128L LQFP 2MTX | 0.125 | 0.15 | 180×180 | C7025 | 0.17 | 14×20 | 2×8 | Spot-Ag / DoubleR-Ag |
| 128L QFP | 0.15 | 0.148 | 315×315 | C7025 | 0.33 | 28×28 | 1×4 | Spot-Ag |