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Electronic Assembly Materials SMI agent variety of well-known international brands of electronic assembly materials, products can be widely used in automotive electronics, general consumer industries, defense and aerospace, handheld devices, LED industry, green environmental protection industry, medical devices, RFID, wireless communications, as well as in many other areas of the electronics industry. |
For color filter production, the P3® line of cleaners, developers and strippers ensures that the essential FPD color filters are prepared properly and are very stable for the subsequent module assembly process. With both off-the-shelf and customer-developed materials, Henkel’s FPD line of materials enable
highly efficient, advanced product manufacture.
Module and panel assembly materials are also part
of Henkel’s core competency.
The Loctite® brand
of UV curable temporary bonding and endseal
materials are used to deliver a robust, complete
panel assembly. In addition, Henkel has developed
pin terminal bonding, overcoat and flexible printed
circuit materials to help reinforce and facilitate
exceptional and reliable product-to-host connection.
| Product Type | Product no. |
|
Display Sealants |
LOCTITE3702™ LOCTITE3730™ LOCTITE3733™ LOCTITE3781™ |
|
Pin Terminal/Temporary Bonding |
LOCTITE®350™ LOCTITE®352™ LOCTITE®3523™ LOCTITE®3719™ LOCTITE®3751™ LOCTITE®3779™ LOCTITE®3780™ LOCTITE®3781™ LOCTITE®3782™ |
Representation of the above products only provide a reference, for more Plasma Cleaner information please contact us +886-2-2758-0920