Products
|
Electronic Assembly Materials SMI agent variety of well-known international brands of electronic assembly materials, products can be widely used in automotive electronics, general consumer industries, defense and aerospace, handheld devices, LED industry, green environmental protection industry, medical devices, RFID, wireless communications, as well as in many other areas of the electronics industry. |
Soldering Paste/Soldering ball/Flux
DanYang Soltec Korea is an ISO manufacturers which product solder paste, solder balls, solder bar, flux and so on. Tin powder particle size is between 5 ~ 45 um; products advertised not to harm the environment and human. It has the world's sole patent certification, using a variety of sophisticated testing equipment to control product quality, and has gain favor from the manufacturers of US, Japan, and South Korea.
Solder Paste
| Model | Flux Type | Alloy | Powder Size | Melting Point | Features |
 | No Clean | 63Sn/37Pb 62Sn/36Pb/2Ag NT4S |
20~45um 20~30um 5~10um | 183°C 179°C1 78~184°C |
◎ Excellent Wetting Characteristic ◎ No Cleaning Solderpaste ◎ Good Printerability for Fine Pitch ◎ Fast Printing Speed and little adhere ◎ Halide free |
 | Water | 63Sn/37Pb 62Sn/36Pb/2Ag NT4S |
20~45um 20~30um 5~10um | 183°C 179°C1 78~184°C |
◎ Excellent Wetting Characteristic ◎ No Cleaning Solderpaste ◎ Good Printerability for Fine Pitch ◎ Fast Printing Speed and little adhere ◎ Halide free |
 | No Clean | 96.5Sn/ 3.0Ag/ 0.5Cu Sn/1.7Bi/ 0.8Cu/ 0.6In (Patent) 42Sn/ 58Bi |
0~45Bm 20~30Bm | 217~220°C 205~221°C 139°C |
◎ Excellent Wetting Characteristic ◎ No Cleaning Solderpaste ◎ Good Printerability for Fine Pitch ◎ Fast Printing Speed and little adhere ◎ Halide free ◎ Minimize Flux Carbonization |
 | Water | 96.5Sn/ 3.0Ag/ 0.5Cu Sn/ 1.7Bi/ 0.8Cu/ 0.6In (Patent) 42Sn/ 58Bi |
20~45Bm 20~30Bm | 217~220°C 205~221°C 139°C |
◎ Excellent Wetting Characteristic ◎ No Cleaning Solderpaste ◎ Good Printerability for Fine Pitch ◎ Fast Printing Speed and little adhere ◎ Halide free ◎ Minimize Flux Carbonization ◎ Minimize Flux Carbonization |
Solder Ball
| Model | Flux Type | Alloy | Powder Size | Melting Point | Features |
 | Ball | Sn/Pb Sn/Ag/Cu Sn/Ag/Cu/X Sn/Bi/Cu/In |
762, 630 530, 450 350, 300 250 Bm | 183°C 217~220°C 205~221°C |
◎Excellent Wetting Characteristic ◎Sphere ◎Shiny ◎Many kind of Alloy |
Flux
| Model | Flux Type | Appearance | Solid Contents | S/G (25°C) | Features |
 | No Clean | Pale Yellow | 5.5% | 0.800 Typical | ◎Excellent Surface Wetting ◎Rosin Type ◎Very Little Residue ◎Halide free |
 | No Clean | Clear Colorless | 5% | 1.020 Typical | ◎Excellent Surface Wetting ◎VOC & Halide free ◎Very little Residue ◎Water Soluble ◎Leadfree Application |
 | Water | Gel type amber | - | - | ◎BGA Package Application ◎Excellent Surface Wetting ◎VOC & Halide free ◎Neutrality |
 | No Clean | Gel type amber | - | - | ◎BGA Package Application ◎Excellent Surface Wetting ◎VOC & Halide free ◎Neutrality ◎Water Cleanable |
