Products
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Electronic Assembly Materials SMI agent variety of well-known international brands of electronic assembly materials, products can be widely used in automotive electronics, general consumer industries, defense and aerospace, handheld devices, LED industry, green environmental protection industry, medical devices, RFID, wireless communications, as well as in many other areas of the electronics industry. |
CSP Underfills/Underfill
Henkel offers innovative capillary flow underfill
encapsulants for Flip Chip, CSP and BGA devices.
These are highly flowable, high purity, onecomponent
encapsulants. They form a uniform and
void-free underfill layer to improve the reliability
performance by redistributing stress away from
the solder interconnects as well as enhancing
mechanical performance.
We have formulations
that quickly fill very small gap/pitch parts that offer
fast cure capabilities, have a long pot and shelf life,
and are reworkable. Reworkability allows for cost
savings by allowing the removal of the underfill to
enable re-use of a board.
| Product type. | Product no. |
Capillary Flows | LOCTITE®3500™ LOCTITE®3513™ LOCTITE® 3536™ LOCTITE® 3563™ LOCTITE® 3593™ |
| LOCTITE®3508™ |
|
Edgebonds |
LOCTITE®3128™ LOCTITE®3705™ |
|
Epoxy Fluxes | HYSOL® FF6000™ |
Representation of the above products only provide a reference, for more information please contact us +886-2-2758-0920
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