Encapsulants are used to provide environmental protection and add mechanical strength to wire bonded devices. Two different application technologies are employed for the protective encapsulation of wire bonded die: • Glob top technology requires an encapsulant with a fine-tuned rheology, as the flow capabilities must allow the wires to be covered without the encapsulant flowing beyond the chip. • Dam and fill technology, where the dam is used to limit the flow of the low viscosity fill material, allowing its use with fine pitch wire leads. Henkel’s Hysol® and Eccobond™ encapsulants are available as either thermal or ultraviolet cure materials and are designed for the highest reliability in that they offer low coefficient of thermal expansion, high glass transition temperature, and low ionic content. These encapsulants have been engineered to provide protection to wire bonds, leads, aluminium and silicon dies from harsh environments, mechanical damage and corrosion. Formulated from epoxy, polyurethane, acrylate (UV curable) and silicone chemistries, these systems have proven reliability for electronic insulation. Henkel encapsulants offer excellent elevated temperature stability and thermal shock resistance, outstanding electrical insulation at both room and elevated temperatures, minimal shrinkage and low stress during cure, as well as excellent chemical resistance. Our encapsulants have been designed to offer high throughput and low-cost assembly processes.

Group as follow: Dam , fill and Glob Top

Dam & Fill	HYSOL®FP4451™ HYSOL®FP4451TD™ HYSOL® FP6401™ HYSOL® FP4450™ HYSOL® FP4450HF™ HYSOL® FP4450LV™ HYSOL® FP4470™
Glob Tops	HYSOL® EO1060™ HYSOL® EO1062™ HYSOL® EO1072™ LOCTITE®3119™ LOCTITE®3129™ HYSOL®EO1080™ HYSOL® EO1016™ HYSOL® FP4460™ HYSOL® OT0149-3™

Representation of the above products only provide a reference, for more information please contact us +886-2-2758-0920